Ultimate Monolithic-3D Integration With 2D Materials: Rationale, Prospects, and Challenges

Ultimate Monolithic-3D Integration With 2D Materials: Rationale, Prospects, and Challenges

As a possible pathway to continue Moore's law indefinitely into the future as well as unprecedented beyond-Moore heterogeneous integration, we examine the prospects of building monolithic 3D integrated circuits (M3D-IC) with atomically-thin or 2D van der Waals materials in terms of overcoming t...

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Bibliographic Details
Main Authors: Junkai Jiang, Kamyar Parto, Wei Cao, Kaustav Banerjee
Format: Article
Language:English
Published: IEEE 2019-01-01
Series:IEEE Journal of the Electron Devices Society
Subjects:
3D integration
2D layered materials
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beyond-Moore integration
Online Access:https://ieeexplore.ieee.org/document/8746192/

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https://ieeexplore.ieee.org/document/8746192/

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