Kernel-Density-Based Particle Defect Management for Semiconductor Manufacturing Facilities
In a semiconductor manufacturing process, defect cause analysis is a challenging task because the process includes consecutive fabrication phases involving numerous facilities. Recently, in accordance with the shrinking chip pitches, fabrication (FAB) processes require advanced facilities and design...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2018-02-01
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| Series: | Applied Sciences |
| Subjects: | |
| Online Access: | http://www.mdpi.com/2076-3417/8/2/224 |