MONITORING OF IC ENCAPSULATION PROCESS

MONITORING OF IC ENCAPSULATION PROCESS

High reliability of ASICs in metal-ceramic packages at the stage of manufacturing is achieved as a result of minimization of moisture content inside the package and due to continuous measurements of parameters of the encapsulation environment. It is shown that the use of instruments for checking the...

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Bibliographic Details
Main Authors: V. A. Saladukha, V. S. Turtsevitch, J. A. Solovjov, I. I. Rubtsevitch, A. F. Kerentsev, A. A. Dovzhenko, I. V. Chirko
Format: Article
Language:English
Published: Belarusian National Technical University 2015-03-01
Series:Pribory i Metody Izmerenij
Subjects:
integrated circuits
moisture
monitoring
Online Access:https://pimi.bntu.by/jour/article/view/25

Internet

https://pimi.bntu.by/jour/article/view/25

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