Existence of solutions for thermoelastic semiconductor equations

We study a model for the semiconductor problem that consists of a system of dynamic thermoelasticity equations of displacement and semiconductor equations. This problem arises from the observation that semiconductor devices are too often cracked and broken because of the thermal stresses. Since...

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Bibliographic Details
Main Author: Xiaoqin Wu
Format: Article
Language:English
Published: Texas State University 2009-04-01
Series:Electronic Journal of Differential Equations
Subjects:
Online Access:http://ejde.math.txstate.edu/conf-proc/17/w1/abstr.html