Transient Liquid Phase Bonding of Magnesium Alloy AZ31 Using Cu Coatings and Cu Coatings with Sn Interlayers
Transient liquid phase bonding (TLP) of AZ31 samples has been investigated using Cu coatings and Cu coatings with Sn interlayer. Copper coatings were used for one set of the bonds, and a combination of Cu coatings and Sn interlayer was used for the other set of bonds. The bonding temperature was fix...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2018-01-01
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| Series: | Metals |
| Subjects: | |
| Online Access: | http://www.mdpi.com/2075-4701/8/1/60 |