Electroplating of the conform electrodes for obtaining of a tunnel transition with a vacuum nano-clearance
Electroplating of a Cu electrode on a Si substrate is carried into effect in order to get vacuum nano-clearance of a big area for the thermotunnel devices. For obtaining the correct geometry of such an electrode and reduction of the internal tension, there were used the rotation of the cathode, vari...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Politehperiodika
2009-04-01
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| Series: | Tekhnologiya i Konstruirovanie v Elektronnoi Apparature |
| Subjects: | |
| Online Access: | http://www.tkea.com.ua/tkea/2009/2_2009/pdf/10.zip |