Cleaving of Extremely Porous Polymer Fibers
Different cleaving techniques, based on the use of a semiconductor dicing saw, focused-ion-beam milling, and a 193-nm ultraviolet laser, have been exploited to cleave highly porous polymer fibers developed for guiding terahertz radiation. Porous fibers made up of two different polymer materials have...
Main Authors: | , , , , , , |
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Format: | Article |
Language: | English |
Published: |
IEEE
2009-01-01
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Series: | IEEE Photonics Journal |
Subjects: | |
Online Access: | https://ieeexplore.ieee.org/document/5356213/ |