Fabrication of Cu-CuG nanocomposites with enhanced mechanical strength and reduced electrical resistivity
Graphene was ball-milled with copper powder to acquire copper-graphene (CuG) powder. One and two percent of CuG in weight were added to stacking layers of fully annealed copper sheets and processed using 2, 4 and 6 cycles of accumulative roll bonding (ARB), leading to 2 mm thick copper-graphene nano...
| Main Authors: | , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2021-03-01
|
| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785421000454 |