A holistic X-ray analytical approach to support sensor design and fabrication: Strain and cracking analysis for wafer bonding processes
Devices such as sensors, actuators, or micro-electromechanical systems (MEMS) are obtained by a variety of microfabrication processes. Many of these processes influence the material systems by the introduction of strain and defects, which may affect the final device's performance and reliabilit...
| Main Authors: | , , , , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2021-11-01
|
| Series: | Materials & Design |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S0264127521006079 |