Research of Joining Brittle Nonmetallic Materials with an Active Solder
This paper deals with soldering high-purity brittle, nonmetallic materials such as SiO2, Si, and C (graphite). However, these materials exert poor wettability when using tin solder. Therefore, to reduce the wetting angle, an Sn solder alloyed with active Ti element was used. At a soldering temperatu...
| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
Hindawi Limited
2014-01-01
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| Series: | Advances in Materials Science and Engineering |
| Online Access: | http://dx.doi.org/10.1155/2014/729135 |