Interface trap charges associated reliability analysis of Si/Ge heterojunction dopingless TFET

Abstract The interface trap charges (ITC) associated reliability analysis of a charge‐plasma based asymmetric double‐gate (ADG) dopingless tunnel field effect transistor (DLTFET) with Si/Ge heterojunction and high‐κ gate dielectric (HJADGDLTFET) has been studied. The HJADGDLTFET uses silicon at the...

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Main Authors: Suruchi Sharma, Rikmantra Basu, Baljit Kaur
Format: Article
Language:English
Published: Wiley 2021-08-01
Series:IET Circuits, Devices and Systems
Online Access:https://doi.org/10.1049/cds2.12037
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spelling doaj-beb5ae401c14460dad9e5b7eaa33783a2021-07-15T12:27:54ZengWileyIET Circuits, Devices and Systems1751-858X1751-85982021-08-0115542443310.1049/cds2.12037Interface trap charges associated reliability analysis of Si/Ge heterojunction dopingless TFETSuruchi Sharma0Rikmantra Basu1Baljit Kaur2Department of Electronics and Communication Engineering National Institute of Technology Delhi Delhi IndiaDepartment of Electronics and Communication Engineering National Institute of Technology Delhi Delhi IndiaDepartment of Electronics and Communication Engineering National Institute of Technology Delhi Delhi IndiaAbstract The interface trap charges (ITC) associated reliability analysis of a charge‐plasma based asymmetric double‐gate (ADG) dopingless tunnel field effect transistor (DLTFET) with Si/Ge heterojunction and high‐κ gate dielectric (HJADGDLTFET) has been studied. The HJADGDLTFET uses silicon at the drain and the channel region, and germanium at the source region, which enhances the band‐to‐band tunnelling at the source‐channel junction, and hence drive current is increased by one order concerning ADGDLTFET. Also, ADG and high‐κ dielectric (HfO2) have been used to maintain low off‐state current values. The primary intention of this work is to investigate the impact of ITC for HJADGDLTFET and compare it for ADGDLTFET considering DC, analog/RF, and linearity parameters such as transfer characteristics, electric‐field, electric potential, first‐, second‐, and third‐order transconductances (gm1, gm2, and gm3), gate‐to‐drain capacitance (Cgd), cut‐off frequency (fT), gain–bandwidth product, device efficiency, second‐ and third‐order voltage intercept points (VIP2, VIP3), third‐order input intercept points (IIP3), and third‐order intermodulation distortion. The ATLAS simulation results show that the HJADGDLTFET is more immune to ITC variation than conventional ADGDLTFET concerning different polarities of ITC available at the semiconductor‐oxide interface.https://doi.org/10.1049/cds2.12037
collection DOAJ
language English
format Article
sources DOAJ
author Suruchi Sharma
Rikmantra Basu
Baljit Kaur
spellingShingle Suruchi Sharma
Rikmantra Basu
Baljit Kaur
Interface trap charges associated reliability analysis of Si/Ge heterojunction dopingless TFET
IET Circuits, Devices and Systems
author_facet Suruchi Sharma
Rikmantra Basu
Baljit Kaur
author_sort Suruchi Sharma
title Interface trap charges associated reliability analysis of Si/Ge heterojunction dopingless TFET
title_short Interface trap charges associated reliability analysis of Si/Ge heterojunction dopingless TFET
title_full Interface trap charges associated reliability analysis of Si/Ge heterojunction dopingless TFET
title_fullStr Interface trap charges associated reliability analysis of Si/Ge heterojunction dopingless TFET
title_full_unstemmed Interface trap charges associated reliability analysis of Si/Ge heterojunction dopingless TFET
title_sort interface trap charges associated reliability analysis of si/ge heterojunction dopingless tfet
publisher Wiley
series IET Circuits, Devices and Systems
issn 1751-858X
1751-8598
publishDate 2021-08-01
description Abstract The interface trap charges (ITC) associated reliability analysis of a charge‐plasma based asymmetric double‐gate (ADG) dopingless tunnel field effect transistor (DLTFET) with Si/Ge heterojunction and high‐κ gate dielectric (HJADGDLTFET) has been studied. The HJADGDLTFET uses silicon at the drain and the channel region, and germanium at the source region, which enhances the band‐to‐band tunnelling at the source‐channel junction, and hence drive current is increased by one order concerning ADGDLTFET. Also, ADG and high‐κ dielectric (HfO2) have been used to maintain low off‐state current values. The primary intention of this work is to investigate the impact of ITC for HJADGDLTFET and compare it for ADGDLTFET considering DC, analog/RF, and linearity parameters such as transfer characteristics, electric‐field, electric potential, first‐, second‐, and third‐order transconductances (gm1, gm2, and gm3), gate‐to‐drain capacitance (Cgd), cut‐off frequency (fT), gain–bandwidth product, device efficiency, second‐ and third‐order voltage intercept points (VIP2, VIP3), third‐order input intercept points (IIP3), and third‐order intermodulation distortion. The ATLAS simulation results show that the HJADGDLTFET is more immune to ITC variation than conventional ADGDLTFET concerning different polarities of ITC available at the semiconductor‐oxide interface.
url https://doi.org/10.1049/cds2.12037
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AT rikmantrabasu interfacetrapchargesassociatedreliabilityanalysisofsigeheterojunctiondopinglesstfet
AT baljitkaur interfacetrapchargesassociatedreliabilityanalysisofsigeheterojunctiondopinglesstfet
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