Hybrid Systems-in-Foil—Combining the Merits of Thin Chips and of Large-Area Electronics

Hybrid Systems-in-Foil—Combining the Merits of Thin Chips and of Large-Area Electronics

This paper reports on the status of a comprehensive ten-year research and development effort toward hybrid system-in-foil (HySiF). In HySiF, the merits of high-performance integrated circuits on ultra-thin chips and of large-area and discrete electronic component implementation are combined in a com...

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Bibliographic Details
Main Authors: Joachim N. Burghartz, Golzar Alavi, Bjorn Albrecht, Thomas Deuble, Mourad Elsobky, Saleh Ferwana, Christine Harendt, Yigit Mahsereci, Harald Richter, Zili Yu
Format: Article
Language:English
Published: IEEE 2019-01-01
Series:IEEE Journal of the Electron Devices Society
Subjects:
Hybrid integrated circuits
thin film circuits
flexible electronics
micro assembly
multichip modules
chip scale packaging
Online Access:https://ieeexplore.ieee.org/document/8629997/

Internet

https://ieeexplore.ieee.org/document/8629997/

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