Epoxy-Thiol Systems Filled with Boron Nitride for High Thermal Conductivity Applications
An epoxy-thiol system filled with boron nitride (BN), in the form of 80 µm agglomerates, has been investigated with a view to achieving enhanced thermal conductivity. The effect of BN content on the cure reaction kinetics has been studied by differential scanning calorimetry (DSC) and the thermal co...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2018-03-01
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| Series: | Polymers |
| Subjects: | |
| Online Access: | http://www.mdpi.com/2073-4360/10/3/340 |