Research on generalized testing technology of DC-40 GHz RF microsystem in BGA package
The RF microsystem is the future development trend of electronic equipment miniaturization, and the ball grid array(BGA) is one of its common implementation forms. Because the BGA package cannot be measured by being connected to a vector network analyzer, the testing technology of the RF BGA package...
Main Authors: | Zhang Xiaoqing, Liu Dexi, Zhu Dalong, Shi Lei, Liu Yawei |
---|---|
Format: | Article |
Language: | zho |
Published: |
National Computer System Engineering Research Institute of China
2021-01-01
|
Series: | Dianzi Jishu Yingyong |
Subjects: | |
Online Access: | http://www.chinaaet.com/article/3000127712 |
Similar Items
-
Modeling, design, fabrication and reliability characterization of ultra-thin glass BGA package-to-board interconnections
by: Singh, Bhupender
Published: (2016) -
Influence of Underfill on Ball Grid Array (BGA) Package Fatigue Life
by: Chilakamarthi, Geetha
Published: (2004) -
An Investigation of BGA Electronic Packaging Moiré Interferometry
by: Rivers, Norman
Published: (2003) -
Detection of Defects of BGA by Tomography Imaging
by: Tetsuhiro SUMIMOTO, et al.
Published: (2005-08-01) -
Surface-mountable LTCC-SiP module approach for reliable RF and millimetre-wave packaging
by: Kangasvieri, T. (Tero)
Published: (2008)