Research on generalized testing technology of DC-40 GHz RF microsystem in BGA package
The RF microsystem is the future development trend of electronic equipment miniaturization, and the ball grid array(BGA) is one of its common implementation forms. Because the BGA package cannot be measured by being connected to a vector network analyzer, the testing technology of the RF BGA package...
Main Authors: | , , , , |
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Format: | Article |
Language: | zho |
Published: |
National Computer System Engineering Research Institute of China
2021-01-01
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Series: | Dianzi Jishu Yingyong |
Subjects: | |
Online Access: | http://www.chinaaet.com/article/3000127712 |