Package Reliability of MEMS Sensors Used in Automotive Under Random Vibration
The package and interconnection are critical concerns that influence the reliability of MEMS sensors applied in modern automotive under random vibration conditions. This paper conducts a research on this problem to reveal the reliability and influencing factors of MEMS on board level using finite el...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
AIDIC Servizi S.r.l.
2013-07-01
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| Series: | Chemical Engineering Transactions |
| Online Access: | https://www.cetjournal.it/index.php/cet/article/view/6288 |