Electron backscatter diffraction (EBSD) microstructure evolution in HPT copper annealed at a low temperature
Detailed EBSD analysis was performed on copper specimens processed by high-pressure torsion at P = 6 GPa for one whole turn and subsequently annealed at a temperature of 100 °C for 15, 30 and 60 min. The basic microstructural parameters (mean grain size, GB statistics, microtexture) were evaluated i...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2014-10-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785414000556 |