Thermally induced deformations in die-substrate assembly
The work focuses on the thermally induced deformations caused by the processing of Flip Chip Ball Grid Arrays (FCBGA). Analytical expressions for substrate displacements are derived based on the Plate Theory and Suhir's solution for stresses in tri-material assembly. The validity of the model i...
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| Format: | Article |
| Language: | English |
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Serbian Society of Mechanics & Mathematical Institute of the Serbian Academy of Sciences and Arts, Belgrade
2008-01-01
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| Series: | Theoretical and Applied Mechanics |
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| Online Access: | http://www.doiserbia.nb.rs/img/doi/1450-5584/2008/1450-55840803305V.pdf |