Probabilistic methodology for reliability assessment of electronic packages

Probabilistic methodology for reliability assessment of electronic packages

In the mechatronic devices, the finite element analyses are the most used method to determine time-dependent solder joint fatigue response under accelerated temperature cycling conditions, the deterministic analyses are the most used methods. However, the design variables show variability and random...

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Bibliographic Details
Main Authors: Hamdani H., Radi B., El Hami A.
Format: Article
Language:English
Published: EDP Sciences 2019-01-01
Series:MATEC Web of Conferences
Subjects:
Chip-Scale Packages
Finite-element analysis
Kriging metamodel
Monte-Carlo
Solder joint
Online Access:https://www.matec-conferences.org/articles/matecconf/pdf/2019/35/matecconf_cmm18_02002.pdf
Description
Summary:In the mechatronic devices, the finite element analyses are the most used method to determine time-dependent solder joint fatigue response under accelerated temperature cycling conditions, the deterministic analyses are the most used methods. However, the design variables show variability and randomness which will affect the lifetime prediction quality. This paper focuses on solder joint reliability in tape-based chip-scale packages(CSP) with the consideration of uncertainties in material parameters.
ISSN:2261-236X

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