Probabilistic methodology for reliability assessment of electronic packages
In the mechatronic devices, the finite element analyses are the most used method to determine time-dependent solder joint fatigue response under accelerated temperature cycling conditions, the deterministic analyses are the most used methods. However, the design variables show variability and random...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
EDP Sciences
2019-01-01
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| Series: | MATEC Web of Conferences |
| Subjects: | |
| Online Access: | https://www.matec-conferences.org/articles/matecconf/pdf/2019/35/matecconf_cmm18_02002.pdf |