Fabricating Capacitive Micromachined Ultrasonic Transducers with Wafer Bonding Technique
We report the fabrication of capacitive micromachined ultrasonic transducer by wafer bonding technique. Membrane is transferred from SOI wafer to the prime wafer having silicon dioxide cavity. The thickness of cavity height depends on silicon dioxide grown on prime wafer by dry/wet oxidation. Thinni...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
IFSA Publishing, S.L.
2008-06-01
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| Series: | Sensors & Transducers |
| Subjects: | |
| Online Access: | http://www.sensorsportal.com/HTML/DIGEST/june_08/P_284.pdf |