Surface characteristics and damage distributions of diamond wire sawn wafers for silicon solar cells

Surface characteristics and damage distributions of diamond wire sawn wafers for silicon solar cells

This paper describes surface characteristics, in terms of its morphology, roughness and near-surface damage of Si wafers cut by diamond wire sawing (DWS) of Si ingots under different cutting conditions. Diamond wire sawn Si wafers exhibit nearly-periodic surface features of different spatial wavelen...

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Bibliographic Details
Main Authors: Bhushan Sopori, Srinivas Devayajanam, Prakash Basnyat
Format: Article
Language:English
Published: AIMS Press 2016-06-01
Series:AIMS Materials Science
Subjects:
sawing damage
diamond wire sawing
silicon wafers
Online Access:http://www.aimspress.com/Materials/article/815/fulltext.html

Internet

http://www.aimspress.com/Materials/article/815/fulltext.html

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