Analysis of electromigration phenomenon in thick-film and LTCC structures at elevated temperature

Analysis of electromigration phenomenon in thick-film and LTCC structures at elevated temperature

Bibliographic Details
Main Authors:	Nowak Damian, Stafiniak Andrzej, Dziedzic Andrzej
Format:	Article
Language:	English
Published:	Sciendo 2014-06-01
Series:	Materials Science-Poland
Subjects:	ltcc thick-film electromigration reliability
Online Access:	https://doi.org/10.2478/s13536-013-0182-9

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