Analysis of electromigration phenomenon in thick-film and LTCC structures at elevated temperature
| Main Authors: | , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Sciendo
2014-06-01
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| Series: | Materials Science-Poland |
| Subjects: | |
| Online Access: | https://doi.org/10.2478/s13536-013-0182-9 |