Soldering of Passive Components Using Sn Nanoparticle Reinforced Solder Paste: Influence on Microstructure and Joint Strength

Soldering of Passive Components Using Sn Nanoparticle Reinforced Solder Paste: Influence on Microstructure and Joint Strength

In this study, the effects of adding Sn nanopowder (particle size < 150 nm) to three solder pastes SAC3-X(H)F3+, SCAN-Ge071-XF3+, and water washable WW50-SAC3 are evaluated regarding microstructure, morphology, joint strength, and electrical resistance. The nanopowder was added at a rate of 1...

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Bibliographic Details
Main Authors: Anas M. Atieh, Tala J. Abedalaziz, Abdulaziz AlHazaa, Michael Weser, Wael G. Al-Kouz, Maen S. Sari, Ibrahim Alhoweml
Format: Article
Language:English
Published: MDPI AG 2019-10-01
Series:Nanomaterials
Subjects:
nanocomposite solders paste
reflow soldering
solder reliability
soldering ct scan
Online Access:https://www.mdpi.com/2079-4991/9/10/1478

Internet

https://www.mdpi.com/2079-4991/9/10/1478

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