Relative Contributions of Packaging Elements to the Thermal Hysteresis of a MEMS Pressure Sensor

Relative Contributions of Packaging Elements to the Thermal Hysteresis of a MEMS Pressure Sensor

Piezoresistive silicon pressure sensor samples were thermally cycled after being consecutively packaged to three different levels. These started with the absolute minimum to allow measurement of the output and with each subsequent level incorporating additional packaging elements within the build. F...

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Bibliographic Details
Main Authors: Youssef Hamid, David A. Hutt, David C. Whalley, Russell Craddock
Format: Article
Language:English
Published: MDPI AG 2020-03-01
Series:Sensors
Subjects:
packaging levels
consecutive packaging
piezoresistive pressure sensor
thermal hysteresis
polynomial fitting
Online Access:https://www.mdpi.com/1424-8220/20/6/1727

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https://www.mdpi.com/1424-8220/20/6/1727

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