Microhardness analysis of thin metallic multilayer composite films on copper substrates

Microhardness analysis of thin metallic multilayer composite films on copper substrates

Composite systems of alternately electrodeposited nanocrystalline Ni and Cu films on cold-rolled polycrystalline copper substrates were fabricated. Highly-densified parallel interfaces which can give rise to high strength of composites are obtained by depositing layers at a very narrow spacing. T...

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Bibliographic Details
Main Authors: Lamovec J., Jović V., Vorkapić M., Popović B., Radojević V., Aleksić R.
Format: Article
Language:English
Published: Technical Faculty, Bor 2011-01-01
Series:Journal of Mining and Metallurgy. Section B: Metallurgy
Subjects:
composite hardness
Vickers microhardness
hardness models
Ni/Cu electrodeposition
multilayers
Online Access:http://www.doiserbia.nb.rs/img/doi/1450-5339/2011/1450-53391101053L.pdf

Internet

http://www.doiserbia.nb.rs/img/doi/1450-5339/2011/1450-53391101053L.pdf

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