Investigation on the release of residual stress in a folded structure applied to MEMS devices
Abstract During MEMS device fabrication process, the residual stress of thin film caused by thermal expansion coefficient mismatch and lattice mismatch is an important factor that will deteriorate the properties of thin film and bring yield losses to MEMS devices. In this work, a method to release t...
| Main Authors: | , , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Wiley
2021-08-01
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| Series: | Micro & Nano Letters |
| Online Access: | https://doi.org/10.1049/mna2.12026 |