Formation of Nanolaminated Structure with Enhanced Thermal Stability in Copper

• Main Authors: Jianxin Hou, Xiuyan Li, Ke Lu
• Format: Article
• Language: English
• Published: MDPI AG 2021-08-01
• Series: Nanomaterials
• Subjects: nanolaminated structure; deformation mechanism; low angle grain boundaries; thermal stability; copper
• Online Access: https://www.mdpi.com/2079-4991/11/9/2252
• ISSN: 2079-4991

Nanolaminated structure with an average boundary spacing of 67 nm has been fabricated in copper by high-rate shear deformation at ambient temperature. The nanolaminated structure with an increased fraction of low angle grain boundaries exhibits a high microhardness of 2.1 GPa. The structure coarsening temperature is 180 K higher than that of its equiaxial nanograined counterpart. Formation of nanolaminated structure provides an alternative way to relax grain boundaries and to stabilize nanostructured metals with medium to low stacking faults energies besides activation of partial dislocations.