Formation of Nanolaminated Structure with Enhanced Thermal Stability in Copper

Formation of Nanolaminated Structure with Enhanced Thermal Stability in Copper

Nanolaminated structure with an average boundary spacing of 67 nm has been fabricated in copper by high-rate shear deformation at ambient temperature. The nanolaminated structure with an increased fraction of low angle grain boundaries exhibits a high microhardness of 2.1 GPa. The structure coarseni...

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Bibliographic Details
Main Authors: Jianxin Hou, Xiuyan Li, Ke Lu
Format: Article
Language:English
Published: MDPI AG 2021-08-01
Series:Nanomaterials
Subjects:
nanolaminated structure
deformation mechanism
low angle grain boundaries
thermal stability
copper
Online Access:https://www.mdpi.com/2079-4991/11/9/2252

Internet

https://www.mdpi.com/2079-4991/11/9/2252

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