Power Semiconductor SMD Package Embedded in Multilayered Ceramic for Low Switching Loss

Power Semiconductor SMD Package Embedded in Multilayered Ceramic for Low Switching Loss

We propose a multilayered‐substrate‐based power semiconductor discrete device package for a low switching loss and high heat dissipation. To verify the proposed package, cost‐effective, low‐temperature co‐fired ceramic, multilayered substrates are used. A bare die is attached to an embedded cavity o...

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Bibliographic Details
Main Authors: Dong Yun Jung, Hyun Gyu Jang, Minki Kim, Chi‐Hoon Jun, Junbo Park, Hyun‐Soo Lee, Jong Moon Park, Sang Choon Ko
Format: Article
Language:English
Published: Electronics and Telecommunications Research Institute (ETRI) 2017-12-01
Series:ETRI Journal
Subjects:
Low‐temperature co‐fired ceramic
Multilayered substrate
Power semiconductor
Reliability
Schottky barrier diode
Switching loss
Online Access:https://doi.org/10.4218/etrij.17.0117.0113

Internet

https://doi.org/10.4218/etrij.17.0117.0113

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