Effect of thermal exposure on the stress-rupture life and microstructure of a low Re-containing single crystal alloy
In this paper, the stress-rupture tests of a low Re-containing single crystal alloy IC21 before and after thermal exposure at 1100 °C for various periods of time were conducted under the test condition of 1100 °C/137 MPa, and the microstructure of the tested specimens was characterized by SEM and TE...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2015-02-01
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| Series: | Progress in Natural Science: Materials International |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S1002007115000118 |