Optimal Parameter Design for IC Wire Bonding Process by Using Fuzzy Logic and Taguchi Method

Optimal Parameter Design for IC Wire Bonding Process by Using Fuzzy Logic and Taguchi Method

Fuzzy logic Taguchi method (FLTM) is used to optimize parameters for wire bonding process. The proposed FLTM integrates orthogonal arrays, signal-to-noise ratios, response tables, analysis of variance (ANOVA), fuzzy logic, and multiple performance characteristics index. The main process parameters f...

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Bibliographic Details
Main Authors: Jinn-Tsong Tsai, Cheng-Chung Chang, Wen-Ping Chen, Jyh-Horng Chou
Format: Article
Language:English
Published: IEEE 2016-01-01
Series:IEEE Access
Subjects:
Wire bonding
Taguchi method
fuzzy logic
multiple performance characteristics index
Online Access:https://ieeexplore.ieee.org/document/7492263/

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