Optimal Parameter Design for IC Wire Bonding Process by Using Fuzzy Logic and Taguchi Method
Fuzzy logic Taguchi method (FLTM) is used to optimize parameters for wire bonding process. The proposed FLTM integrates orthogonal arrays, signal-to-noise ratios, response tables, analysis of variance (ANOVA), fuzzy logic, and multiple performance characteristics index. The main process parameters f...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
IEEE
2016-01-01
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| Series: | IEEE Access |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/7492263/ |