Relationship between Viscosity, Microstructure and Electrical Conductivity in Copolyamide Hot Melt Adhesives Containing Carbon Nanotubes
<b> </b>The polymeric adhesive used for the<b> </b>bonding of thermoplastic and thermoset composites forms an insulating layer which causes a real problem for lightning strike protection. In order to make that interlayer electrically conductive, we studied a new group of elec...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2020-10-01
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| Series: | Materials |
| Subjects: | |
| Online Access: | https://www.mdpi.com/1996-1944/13/20/4469 |