A new failure mechanism of electromigration by surface diffusion of Sn on Ni and Cu metallization in microbumps
Abstract Microbumps in three-dimensional integrated circuit now becomes essential technology to reach higher packaging density. However, the small volume of microbumps dramatically changes the characteristics from the flip-chip (FC) solder joints. For a 20 µm diameter microbump, the cross-section ar...
| Main Authors: | , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Nature Publishing Group
2018-04-01
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| Series: | Scientific Reports |
| Online Access: | https://doi.org/10.1038/s41598-018-23809-1 |