Design, fabrication and characterization of a high-sensitivity pressure sensor based on nano-polysilicon thin film transistors

Based on the nano-polysilicon thin film transistors (TFTs), a high-sensitivity pressure sensor was designed and fabricated in this paper. The pressure sensing element is composed of a Wheatstone bridge with four nano-polysilicon TFTs designed on different positions of the square silicon diaphragm. V...

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Main Authors: Xiaofeng Zhao, Yang Yu, Dandan Li, Dianzhong Wen
Format: Article
Language:English
Published: AIP Publishing LLC 2015-12-01
Series:AIP Advances
Online Access:http://dx.doi.org/10.1063/1.4938517
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spelling doaj-9548d84a775a46a4bd6c702844a381372020-11-25T00:53:55ZengAIP Publishing LLCAIP Advances2158-32262015-12-01512127216127216-810.1063/1.4938517035512ADVDesign, fabrication and characterization of a high-sensitivity pressure sensor based on nano-polysilicon thin film transistorsXiaofeng Zhao0Yang Yu1Dandan Li2Dianzhong Wen3Key Laboratory of Electronics Engineering, College of Heilongjiang Province, Heilongjiang University, Harbin, ChinaKey Laboratory of Electronics Engineering, College of Heilongjiang Province, Heilongjiang University, Harbin, ChinaKey Laboratory of Electronics Engineering, College of Heilongjiang Province, Heilongjiang University, Harbin, ChinaKey Laboratory of Electronics Engineering, College of Heilongjiang Province, Heilongjiang University, Harbin, ChinaBased on the nano-polysilicon thin film transistors (TFTs), a high-sensitivity pressure sensor was designed and fabricated in this paper. The pressure sensing element is composed of a Wheatstone bridge with four nano-polysilicon TFTs designed on different positions of the square silicon diaphragm. Via taking the four channel resistors of the TFTs as piezoresistors, the measurement to the external pressure can be realized according to the piezoresistive effects of channel layer. Through adopting complementary metal oxide semiconductor (CMOS) technology and micro-electromechanical system (MEMS) technology, the chips of sensor were fabricated on <100 > orientation silicon wafer with a high resistivity. At room temperature, when applying a voltage 5.0 V to the Wheatstone bridge, the full scale (100 kPa) output voltage and the sensitivity of the sensor with 35 μm-thick silicon diaphragm are 267 mV and 2.58 mV/kPa, respectively. The experimental results show that the pressure sensors can achieve a much higher sensitivity.http://dx.doi.org/10.1063/1.4938517
collection DOAJ
language English
format Article
sources DOAJ
author Xiaofeng Zhao
Yang Yu
Dandan Li
Dianzhong Wen
spellingShingle Xiaofeng Zhao
Yang Yu
Dandan Li
Dianzhong Wen
Design, fabrication and characterization of a high-sensitivity pressure sensor based on nano-polysilicon thin film transistors
AIP Advances
author_facet Xiaofeng Zhao
Yang Yu
Dandan Li
Dianzhong Wen
author_sort Xiaofeng Zhao
title Design, fabrication and characterization of a high-sensitivity pressure sensor based on nano-polysilicon thin film transistors
title_short Design, fabrication and characterization of a high-sensitivity pressure sensor based on nano-polysilicon thin film transistors
title_full Design, fabrication and characterization of a high-sensitivity pressure sensor based on nano-polysilicon thin film transistors
title_fullStr Design, fabrication and characterization of a high-sensitivity pressure sensor based on nano-polysilicon thin film transistors
title_full_unstemmed Design, fabrication and characterization of a high-sensitivity pressure sensor based on nano-polysilicon thin film transistors
title_sort design, fabrication and characterization of a high-sensitivity pressure sensor based on nano-polysilicon thin film transistors
publisher AIP Publishing LLC
series AIP Advances
issn 2158-3226
publishDate 2015-12-01
description Based on the nano-polysilicon thin film transistors (TFTs), a high-sensitivity pressure sensor was designed and fabricated in this paper. The pressure sensing element is composed of a Wheatstone bridge with four nano-polysilicon TFTs designed on different positions of the square silicon diaphragm. Via taking the four channel resistors of the TFTs as piezoresistors, the measurement to the external pressure can be realized according to the piezoresistive effects of channel layer. Through adopting complementary metal oxide semiconductor (CMOS) technology and micro-electromechanical system (MEMS) technology, the chips of sensor were fabricated on <100 > orientation silicon wafer with a high resistivity. At room temperature, when applying a voltage 5.0 V to the Wheatstone bridge, the full scale (100 kPa) output voltage and the sensitivity of the sensor with 35 μm-thick silicon diaphragm are 267 mV and 2.58 mV/kPa, respectively. The experimental results show that the pressure sensors can achieve a much higher sensitivity.
url http://dx.doi.org/10.1063/1.4938517
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AT yangyu designfabricationandcharacterizationofahighsensitivitypressuresensorbasedonnanopolysiliconthinfilmtransistors
AT dandanli designfabricationandcharacterizationofahighsensitivitypressuresensorbasedonnanopolysiliconthinfilmtransistors
AT dianzhongwen designfabricationandcharacterizationofahighsensitivitypressuresensorbasedonnanopolysiliconthinfilmtransistors
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