Application of Wafer Direct Bonding Technique to Optical Nonreciprocal Devices
A wafer direct bonding technique enables one to integrate dissimilar crystals like a magnetooptic garnet on Si and III-V semiconductors, which facilitates fabrication of optical nonreciprocal devices on commonly used waveguide platforms. The surface-activated direct bonding technique is described, f...
| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
IEEE
2011-01-01
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| Series: | IEEE Photonics Journal |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/6058718/ |