Effects of Aspect Ratio in Moulded Packaging Considering Fluid/Structure Interaction: A CFD Modelling Approach
The fluid/structure interaction (FSI) investigations of stacked chip in encapsulation process of moulded underfill packaging using the two-way Coupling method with ANSYS Fluent and ANSYS Structural solvers are presented. The FSI study is executed with different aspect ratio of stacked chip on the mo...
| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Isfahan University of Technology
2017-01-01
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| Series: | Journal of Applied Fluid Mechanics |
| Subjects: | |
| Online Access: | http://jafmonline.net/JournalArchive/download?file_ID=43833&issue_ID=245 |