Software implementation of the three-dimensional modeling of thermal processes in multilayer integrated circuits for space purposes
In this paper we consider software implementation of three-dimensional modeling of thermal processes in multilayer integrated circuits based on low-temperature co-veneering ceramic. The results obtained by the software implemented by the example of the radio frequency receiver module based on low-te...
| Main Authors: | , , |
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| Format: | Article |
| Language: | Russian |
| Published: |
Institute of Computer Science
2014-06-01
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| Series: | Компьютерные исследования и моделирование |
| Subjects: | |
| Online Access: | http://crm.ics.org.ru/uploads/crmissues/crm_2014_3/14305.pdf |