TRIC: A Thermal Resistance and Impedance Calculator for Electronic Packages

• Main Authors: Lorenzo Codecasa, Francesca De Viti, Vincenzo d’Alessandro, Donata Gualandris, Arianna Morelli, Claudio Maria Villa
• Format: Article
• Language: English
• Published: MDPI AG 2020-05-01
• Series: Energies
• Subjects: electronic packages; detailed thermal model; Joint Electron Device Engineering Council (JEDEC) metrics; thermal impedance; thermal simulation
• Online Access: https://www.mdpi.com/1996-1073/13/9/2252

This paper presents the Thermal Resistance and Impedance Calculator (TRIC) tool devised for the automatic extraction of thermal metrics of package families of electronic components in both static and transient conditions. TRIC relies on a solution algorithm based on a novel projection-based approach, which—unlike previous techniques—allows (i) dealing with parametric detailed thermal models (pDTMs) of package families that exhibit generic non-Manhattan variations of geometries and meshes, and (ii) transforming such pDTMs into compact thermal models that can be solved in short times. Thermal models of several package families are available, and dies with multiple active areas can be handled. It is shown that transient thermal responses of chosen packages can be obtained in a CPU (central processing unit) time much shorter than that required by a widely used software relying on the finite-volume method without sacrificing accuracy.