TRIC: A Thermal Resistance and Impedance Calculator for Electronic Packages

TRIC: A Thermal Resistance and Impedance Calculator for Electronic Packages

This paper presents the Thermal Resistance and Impedance Calculator (TRIC) tool devised for the automatic extraction of thermal metrics of package families of electronic components in both static and transient conditions. TRIC relies on a solution algorithm based on a novel projection-based approach...

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Bibliographic Details
Main Authors: Lorenzo Codecasa, Francesca De Viti, Vincenzo d’Alessandro, Donata Gualandris, Arianna Morelli, Claudio Maria Villa
Format: Article
Language:English
Published: MDPI AG 2020-05-01
Series:Energies
Subjects:
electronic packages
detailed thermal model
Joint Electron Device Engineering Council (JEDEC) metrics
thermal impedance
thermal simulation
Online Access:https://www.mdpi.com/1996-1073/13/9/2252

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https://www.mdpi.com/1996-1073/13/9/2252

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