Research and implementation of AC resistance calculation method for TSV array
Through Silicon Via(TSV), as a key interconnection technology in 3D integrated circuits, is used to connect input and output of chips in different layers. When multiple TSVs with alternating current close to each other, will produce the proximity effect, which increases the resistance of the TSV, th...
| Main Authors: | , |
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| Format: | Article |
| Language: | zho |
| Published: |
National Computer System Engineering Research Institute of China
2018-07-01
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| Series: | Dianzi Jishu Yingyong |
| Subjects: | |
| Online Access: | http://www.chinaaet.com/article/3000085733 |