Study on Improving Thickness Uniformity of Microfluidic Chip Mold in the Electroforming Process

Study on Improving Thickness Uniformity of Microfluidic Chip Mold in the Electroforming Process

Electroformed microfluidic chip mold faces the problem of uneven thickness, which decreases the dimensional accuracy of the mold, and increases the production cost. To fabricate a mold with uniform thickness, two methods are investigated. Firstly, experiments are carried out to study how the ultraso...

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Bibliographic Details
Main Authors: Liqun Du, Tong Yang, Ming Zhao, Yousheng Tao, Lei Luo, Lei Wang, Chong Liu
Format: Article
Language:English
Published: MDPI AG 2016-01-01
Series:Micromachines
Subjects:
microfluidic chip mold
micro-electroforming
uniformity
ultrasonic agitation
second cathode
Online Access:http://www.mdpi.com/2072-666X/7/1/7

Internet

http://www.mdpi.com/2072-666X/7/1/7

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