Compressive mechanical response of graphene foams and their thermal resistance with copper interfaces
We report compressive mechanical response of graphene foams (GFs) and the thermal resistance (RTIM) between copper (Cu) and GFs, where GFs were prepared by the chemical vapor deposition method. We observe that Young’s modulus (EGF) and compressive strength (σGF) of GFs have a power law dependence on...
| Main Authors: | , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
AIP Publishing LLC
2017-03-01
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| Series: | APL Materials |
| Online Access: | http://dx.doi.org/10.1063/1.4978272 |