The Investigation of Conductive Via Properties

The Investigation of Conductive Via Properties

The investigation ofthe Low Temperature Co-fired Ceramic (L TCC) via filling process quality is presented in this paper. The goal of this paper was to propose and to validate a way of the verification whether the L TCC fabrication was conducted correctly. The work presents an application of the Desi...

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Bibliographic Details
Main Authors: Jurkow Dominik, Dorczynski Mateusz, Golonka Leszek
Format: Article
Language:English
Published: Polish Academy of Sciences 2015-03-01
Series:Metrology and Measurement Systems
Subjects:
L TCC
DoE
design
experiment
via
electrical
Online Access:http://www.degruyter.com/view/j/mms.2015.22.issue-1/mms-2015-0007/mms-2015-0007.xml?format=INT
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spelling doaj-8553476ba60c46909db6628a6ffd19a22020-11-25T03:59:50ZengPolish Academy of SciencesMetrology and Measurement Systems2300-19412015-03-01221395010.1515/mms-2015-0007mms-2015-0007The Investigation of Conductive Via PropertiesJurkow Dominik0Dorczynski Mateusz1Golonka Leszek2Wroclaw University of Technology, Faculty of Microsystem Electronics and Photonics, Janiszewskiego 11117, 50-372 Wroclaw, PolandWroclaw University of Technology, Faculty of Microsystem Electronics and Photonics, Janiszewskiego 11117, 50-372 Wroclaw, PolandWroclaw University of Technology, Faculty of Microsystem Electronics and Photonics, Janiszewskiego 11117, 50-372 Wroclaw, PolandThe investigation ofthe Low Temperature Co-fired Ceramic (L TCC) via filling process quality is presented in this paper. The goal of this paper was to propose and to validate a way of the verification whether the L TCC fabrication was conducted correctly. The work presents an application of the Design of the Experiment (DoE) methodology in such validation and discusses usefulness and drawbacks of the chosen solution. The optimized technology of via filling will be applied in the fabrication of tactile displays for blind people.http://www.degruyter.com/view/j/mms.2015.22.issue-1/mms-2015-0007/mms-2015-0007.xml?format=INTL TCCDoEdesignexperimentviaelectrical
collection DOAJ
language English
format Article
sources DOAJ
author Jurkow Dominik
Dorczynski Mateusz
Golonka Leszek
spellingShingle Jurkow Dominik
Dorczynski Mateusz
Golonka Leszek
The Investigation of Conductive Via Properties
Metrology and Measurement Systems
L TCC
DoE
design
experiment
via
electrical
author_facet Jurkow Dominik
Dorczynski Mateusz
Golonka Leszek
author_sort Jurkow Dominik
title The Investigation of Conductive Via Properties
title_short The Investigation of Conductive Via Properties
title_full The Investigation of Conductive Via Properties
title_fullStr The Investigation of Conductive Via Properties
title_full_unstemmed The Investigation of Conductive Via Properties
title_sort investigation of conductive via properties
publisher Polish Academy of Sciences
series Metrology and Measurement Systems
issn 2300-1941
publishDate 2015-03-01
description The investigation ofthe Low Temperature Co-fired Ceramic (L TCC) via filling process quality is presented in this paper. The goal of this paper was to propose and to validate a way of the verification whether the L TCC fabrication was conducted correctly. The work presents an application of the Design of the Experiment (DoE) methodology in such validation and discusses usefulness and drawbacks of the chosen solution. The optimized technology of via filling will be applied in the fabrication of tactile displays for blind people.
topic L TCC
DoE
design
experiment
via
electrical
url http://www.degruyter.com/view/j/mms.2015.22.issue-1/mms-2015-0007/mms-2015-0007.xml?format=INT
work_keys_str_mv AT jurkowdominik theinvestigationofconductiveviaproperties
AT dorczynskimateusz theinvestigationofconductiveviaproperties
AT golonkaleszek theinvestigationofconductiveviaproperties
AT jurkowdominik investigationofconductiveviaproperties
AT dorczynskimateusz investigationofconductiveviaproperties
AT golonkaleszek investigationofconductiveviaproperties
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