The Investigation of Conductive Via Properties
The investigation ofthe Low Temperature Co-fired Ceramic (L TCC) via filling process quality is presented in this paper. The goal of this paper was to propose and to validate a way of the verification whether the L TCC fabrication was conducted correctly. The work presents an application of the Desi...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Polish Academy of Sciences
2015-03-01
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| Series: | Metrology and Measurement Systems |
| Subjects: | |
| Online Access: | http://www.degruyter.com/view/j/mms.2015.22.issue-1/mms-2015-0007/mms-2015-0007.xml?format=INT |