The Investigation of Conductive Via Properties

The Investigation of Conductive Via Properties

The investigation ofthe Low Temperature Co-fired Ceramic (L TCC) via filling process quality is presented in this paper. The goal of this paper was to propose and to validate a way of the verification whether the L TCC fabrication was conducted correctly. The work presents an application of the Desi...

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Bibliographic Details
Main Authors: Jurkow Dominik, Dorczynski Mateusz, Golonka Leszek
Format: Article
Language:English
Published: Polish Academy of Sciences 2015-03-01
Series:Metrology and Measurement Systems
Subjects:
L TCC
DoE
design
experiment
via
electrical
Online Access:http://www.degruyter.com/view/j/mms.2015.22.issue-1/mms-2015-0007/mms-2015-0007.xml?format=INT
Description
Summary:The investigation ofthe Low Temperature Co-fired Ceramic (L TCC) via filling process quality is presented in this paper. The goal of this paper was to propose and to validate a way of the verification whether the L TCC fabrication was conducted correctly. The work presents an application of the Design of the Experiment (DoE) methodology in such validation and discusses usefulness and drawbacks of the chosen solution. The optimized technology of via filling will be applied in the fabrication of tactile displays for blind people.
ISSN:2300-1941

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