Research on Glass Frit Deposition Based on the Electrospray Process
In this paper, the electrospray technology is used to easily deposit the glass frit into patterns at a micro-scale level. First, far-field electrospray process was carried out with a mixture of glass frit in the presence of ethanol. A uniform, smooth, and dense glass frit film was obtained, verifyin...
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MDPI AG
2016-04-01
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| Series: | Materials |
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| Online Access: | http://www.mdpi.com/1996-1944/9/4/292 |
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doaj-83d40e5690b14259900e190c92a0d0d52020-11-24T21:06:31ZengMDPI AGMaterials1996-19442016-04-019429210.3390/ma9040292ma9040292Research on Glass Frit Deposition Based on the Electrospray ProcessYifang Liu0Daner Chen1Zhan Zhan2Chenlei Li3Jianyi Zheng4Daoheng Sun5School of Aerospace Engineering, Xiamen University, Xiamen 361005, ChinaSchool of Aerospace Engineering, Xiamen University, Xiamen 361005, ChinaSchool of Aerospace Engineering, Xiamen University, Xiamen 361005, ChinaSchool of Aerospace Engineering, Xiamen University, Xiamen 361005, ChinaSchool of Aerospace Engineering, Xiamen University, Xiamen 361005, ChinaSchool of Aerospace Engineering, Xiamen University, Xiamen 361005, ChinaIn this paper, the electrospray technology is used to easily deposit the glass frit into patterns at a micro-scale level. First, far-field electrospray process was carried out with a mixture of glass frit in the presence of ethanol. A uniform, smooth, and dense glass frit film was obtained, verifying that the electrospray technology was feasible. Then, the distance between the nozzle and the substrate was reduced to 2 mm to carry out near-field electrospray. The experimental process was improved by setting the range of the feed rate of the substrate to match both the concentration and the flow rate of the solution. Spray diameter could be less at the voltage of 2 kV, in which the glass frit film was expected to reach the minimum line width. A uniform glass frit film with a line width within the range of 400–500 μm was prepared when the speed of the substrate was 25 mm/s. It indicates that electrospray is an efficient technique for the patterned deposition of glass frit in wafer-level hermetic encapsulation.http://www.mdpi.com/1996-1944/9/4/292glass fritfilmpatterned depositionelectrospray |
| collection |
DOAJ |
| language |
English |
| format |
Article |
| sources |
DOAJ |
| author |
Yifang Liu Daner Chen Zhan Zhan Chenlei Li Jianyi Zheng Daoheng Sun |
| spellingShingle |
Yifang Liu Daner Chen Zhan Zhan Chenlei Li Jianyi Zheng Daoheng Sun Research on Glass Frit Deposition Based on the Electrospray Process Materials glass frit film patterned deposition electrospray |
| author_facet |
Yifang Liu Daner Chen Zhan Zhan Chenlei Li Jianyi Zheng Daoheng Sun |
| author_sort |
Yifang Liu |
| title |
Research on Glass Frit Deposition Based on the Electrospray Process |
| title_short |
Research on Glass Frit Deposition Based on the Electrospray Process |
| title_full |
Research on Glass Frit Deposition Based on the Electrospray Process |
| title_fullStr |
Research on Glass Frit Deposition Based on the Electrospray Process |
| title_full_unstemmed |
Research on Glass Frit Deposition Based on the Electrospray Process |
| title_sort |
research on glass frit deposition based on the electrospray process |
| publisher |
MDPI AG |
| series |
Materials |
| issn |
1996-1944 |
| publishDate |
2016-04-01 |
| description |
In this paper, the electrospray technology is used to easily deposit the glass frit into patterns at a micro-scale level. First, far-field electrospray process was carried out with a mixture of glass frit in the presence of ethanol. A uniform, smooth, and dense glass frit film was obtained, verifying that the electrospray technology was feasible. Then, the distance between the nozzle and the substrate was reduced to 2 mm to carry out near-field electrospray. The experimental process was improved by setting the range of the feed rate of the substrate to match both the concentration and the flow rate of the solution. Spray diameter could be less at the voltage of 2 kV, in which the glass frit film was expected to reach the minimum line width. A uniform glass frit film with a line width within the range of 400–500 μm was prepared when the speed of the substrate was 25 mm/s. It indicates that electrospray is an efficient technique for the patterned deposition of glass frit in wafer-level hermetic encapsulation. |
| topic |
glass frit film patterned deposition electrospray |
| url |
http://www.mdpi.com/1996-1944/9/4/292 |
| work_keys_str_mv |
AT yifangliu researchonglassfritdepositionbasedontheelectrosprayprocess AT danerchen researchonglassfritdepositionbasedontheelectrosprayprocess AT zhanzhan researchonglassfritdepositionbasedontheelectrosprayprocess AT chenleili researchonglassfritdepositionbasedontheelectrosprayprocess AT jianyizheng researchonglassfritdepositionbasedontheelectrosprayprocess AT daohengsun researchonglassfritdepositionbasedontheelectrosprayprocess |
| _version_ |
1716765791541526528 |