Thermal depth profiling of materials for defect detection using hot disk technique
A novel application of the hot disk transient plane source technique is described. The new application yields the thermal conductivity of materials as a function of the thermal penetration depth which opens up opportunities in nondestructive testing of inhomogeneous materials. The system uses the ho...
| Main Authors: | , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
AIP Publishing LLC
2016-08-01
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| Series: | AIP Advances |
| Online Access: | http://dx.doi.org/10.1063/1.4961879 |